ZHOU Lu-jie1,2, DANG Jian-wu1,2, WANG Yu-xin3，4
（1. School of Automation and Electrical Engineering, Lanzhou Jiaotong University, Lanzhou 730070, China； 2. Gansu Provincial Engineering Research Center for Artificial Intelligence and Graphic & Image Processing, Lanzhou 730070, China； 3. School of Civil Engineering, Lanzhou Jiaotong University, Lanzhou 730070, China； 4. Northwest Research Institute Co., Ltd. of CREC, Lanzhou 730070, China）
Abstract： As a general format of the image, bitmap(BMP) image has wide applications, and consequently it is an important part of image processing. By segmenting the bitmap and combining the three-dimesional (3D) model of the discrete algorithm with the scanning line compensation algorithm, a mathematical model is built. According to the topological relations between several control points on the model surface， the surface of the model is discretized, and a planar triangle sequence is used to describe 3D objects. Finally, the bitmap is enlarged by combining the borrowing compensation based on 3D modeling principle of discrete algorithm with the scanning line compensation algorithm of binary lattice image, thus getting a relatively clear enlarged BMP image.
Key words： image processing； bitmap （BMP） image； amplifying model； three-dimensional(3D) modeling principle； scanning line compensation algorithm
CLD number： TP39; TN911.73 Document code： A
Article ID： 1674-8042（2019）04-0335-07 doi： 10.3969/j.issn.1674-8042.2019.04.005
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基于三维建模原理的位图图像超分辨率放大研究
周璐婕1,2， 党建武1,2， 王瑜鑫3,4
（1. 兰州交通大学 自动化与电气工程学院， 甘肃 兰州 730070； 2. 甘肃省人工智能与图形图像处理工程研究中心， 甘肃 兰州 730070； 3. 兰州交通大学 土木工程学院， 甘肃 兰州 730070； 4. 中铁西北科学研究院有限公司， 甘肃 兰州 730070）
摘 要: BMP（bitmap）位图图像作为图像的一种通用格式被越广泛应用， 位图放大是图像处理的重要环节。 首先， 对位图进行分割， 将离散算法的三维模型与扫描线补偿算法相结合， 建立数学模型； 然后， 根据模型表面若干个控制点之间的拓扑关系， 将图像表面离散化， 采用平面三角形序列描述三维物体； 最后 ， 将离散算法三维建模原理中的平借补偿与二值点阵图像扫描线补偿算法相结合， 对位图进行放大， 从而得到比较清晰的放大BMP图像。
关键词: 图像处理； 位图图像； 放大模型； 三维建模原理； 扫描线补偿算法
引用格式： ZHOU Lu-jie, DANG Jian-wu, WANG Yu-xin. Super-resolution amplification of bitmap images based on 3D modeling theory. Journal of Measurement Science and Instrumentation, 2019, 10（4）： 335-341. ［doi： 10.3969／j.issn.1674-8042.2019.04.005］
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