Choong-mo NAM, Mi-hee JI
Department of Electronics Engineering, Korea Polytechnic University, Siheung 429-793, Korea
Abstract-Multichip on Aluminum Metal Plate(MOAMP) technology with simple structure and low thermal resistance is developed for effective heat removal of Light Emitting Diode(LED) p-n junction and LED lighting module to h ave high reliability. The thermal resistance of LED modules was numerical and e xperimental. Thermal resistance from the junction to aluminum metal plate, consi dering input power of LED module using MOAMP technology, is 3.02 K/W, 3.23 K/W f or the measured and calculated, respectively. We expect that the reported MOAMP technology with low thermal resistance will be a promising solution for high pow er LED lighting modules.
Key words-thermal resistance; Light Emitting Diode (LED); aluminum metal plate; MOAMP
Manuscript Number: 1674-8042(2010)03-0297-03
dio: 10.3969/j.issn.1674-8042.2010.03.21
References
[1]F. M. Steranka, 2002. High power LEDs-technology status and market applications. Phys. Stat. Sol. (a), 94, (2): 380-388.
[2]N. Narendran, Y. Cu, 2005. Life of LED-based white light sources. IEEE/OSA. J. of Display Tech., 1(1): 167-179.
[3]M. Arik, C. Becker, S. Weaver, J. Petroski, 2004. Thermal Management of LEDs: Package to System. Proc.of SPIE.
[4]Wei-hao Chi, Tsung-lin Chou, Cheng-nan Jan, et al, 2008. Analysis of Thermal Performance of High Power Light Emitting Diodes Package. IEEE/Elect ronics Packaging Technology Conference.
[full text view]
