Young-Min Yoon, No-Su Kim, Eun-Hyuk Kuak, Jae-Kyung Wee, and Boo-Gyoun Kim
School of Electronic Engineering, Soongsil University, Seoul 156-030, Korea
Abstract— This paper describes a method to extract electrical parameters of the through via in Package-on-Package (PoP) with interposer. Using the de-embedding technique electrical parameters of the through via are extracted. With the extracted electrical parameters of the through via, the effects of via height, the distance between signal and GND vias, and anti-pad clearance on the electrical characteristics are discussed.
Keywords— parameter extraction； de-embedding； Package-on-Package (PoP)
Manuscript Number: 1674-8042(2010)supp.-0160-04
dio: 10.3969/j.issn1674-8042.2010.supp..43
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